Belding India Expands into North America through Strategic Partnership for Modular Data Center Solutions

Pune, Sep 21: Belding India Limited, an integrated infrastructure and engineering technology company, pleased to announce that it has entered into a strategic partnership with a US-based technology distribution and OEM supply partner to expand its modular data center business across North America.

Under the partnership, Belding’s partner will exclusively market, distribute, integrate and support the Company’s modular data center systems across the United States, Canada and Mexico. The collaboration will cover complete modular data center solutions, including associated controls, components, spare parts and accessories, supplied under Belding’s own brand as well as on an OEM/ODM basis.
 
The partnership represents an important step in Belding’s international expansion strategy and provides the Company with a platform to take its India-engineered modular data center capabilities to customers across key North American markets.
 
Belding operates on both ODM and OEM models, enabling it to design and build complete infrastructure solutions as well as engineer systems to customer-specific requirements. Through its integrated engineering and manufacturing capabilities, the Company aims to support the deployment of modular, scalable and deployment-ready data center infrastructure.
 
Mr. Umesh Sahay, Chairman, Belding India Limited, said:
“This partnership marks an important milestone in Belding’s journey as we expand our presence into the North American market. We see significant opportunities for modular and rapidly deployable data center infrastructure, and this collaboration provides us with a strong platform to bring our engineering and manufacturing capabilities to customers across the United States, Canada and Mexico. We look forward to building a long-term and mutually rewarding relationship with our partner and strengthening Belding’s presence in global markets.”

Add a Comment

Your email address will not be published. Required fields are marked *